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  TB6569FG 2009-08-21 1 toshiba bi-cmos integrated circuit silicon monolithic TB6569FG full-bridge dc motor driver ic the TB6569FG is a full-bridge dc motor driver with mos output transistors. the low on-resistance mos process and pwm control enables driving dc motors with high thermal efficiency. four operating modes are selectable via in1 and in2: clockwise (cw), counterclockwise (ccw), short brake and stop. features ? power supply voltage: 50 v (max) ? output current: 4.5 a (max) ? direct pwm control ? pwm constasnt-current control ? cw/ccw/short brake/stop modes ? overcurrent shutdown circuit (isd) ? overcurrent detection threshold control ? overcurrent detection time control ? overvoltage shutdown circuit (vsd) ? thermal shutdown circuit (tsd) ? undervoltage lockout circuit (uvlo) ? dead time for preventing shoot-throu gh current note: the following conditions apply to solderability: about solderability, following conditions were confirmed (1) use of sn-37pb solder bath ? solder bath temperature: 230c ? dipping time: 5 seconds ? the number of times: once ? use of r-type flux (2) use of sn-3.0ag-0 .5cu solder bath ? solder bath temperature: 245c ? dipping time: 5 seconds ? the number of times: once ? use of r-type flux weight: 0.5 g (typ.)
TB6569FG 2009-08-21 2 block diagram (application circuit example) the application circuits shown in this document are provided for reference pu rposes only. thorough evaluation is required, especially at the ma ss production design stage. toshiba does not grant any license to any industrial prop erty rights by providing th ese examples of application circuits. in1 rsgnd out1 out2 sgnd 5 v regulator vm vref osc osc uvlo vsd isd detection visd tisd tsd isd isd detection isd detection isd detection 1/10 predriver motor in2 pwm a lert 0.4 v (typ.) level time control
TB6569FG 2009-08-21 3 pin functions pin no. pin name functional description 1 alert error detection output pin 2 osc capacitor pin for controlling oscillation frequency for the pwm constant-current control 3 in1 control signal input pin 1 4 sgnd small signal ground pin 5 in2 control signal input pin 2 6 n.c. no-connect 7 out1 output pin 1 8 rsgnd power ground pin/ detection resistor pin for pwm constant-current control 9 n.c. no-connect 10 out2 output pin 2 11 n.c. no-connect 12 vm power supply voltage pin 13 visd resistor pin for overcurrent detection threshold control 14 tisd resistor pin for overcurrent detection time control 15 pwm pwm input pin 16 vref supply voltage pin for pwm constant-current control ? fin pin-fin heat sink (note) note: since the pin-fin is provided for discharging heat, t he thermal design must be considered on the pcb designing. (the fin is installed on the second surface of the chip and el ectrified; therefore it must be insulated or earthed to the ground.) pin assignment (top view) vref alert n.c. pwm fin rsgnd n.c. vm in2 in1 out2 tisd out1 sgnd osc visd 16 15 14 13 12 11 10 9 n.c. fin 1 2 3 4 5 6 7 8
TB6569FG 2009-08-21 4 absolute maximum ratings (note) (ta = 25c) characteristics symbol rating unit power supply voltage vm 50 v output voltage v o 50 (note 1) v output current 1 i o peak1 4.5 (note 2) a output current 2 i o peak2 4.0 (note 3) a input voltage v in ? 0.3 to 5.5 v alert pin output voltage v alert 5.5 v alert pin output current i alert 5 ma power dissipation p d 0.89 (note 4) w operating temperature t opr ? 40 to 85 c storage temperature t stg ? 55 to 150 c note: the absolute maximum ratings of a semiconductor device are a set of ratings that mu st not be exceeded, even for a moment. do not exceed any of these ratings. exceeding the rating (s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. please use the TB6569FG within the specified operating ranges. note 1: out1, out2 note 2: the absolute maximum output current rating of 4.5 a must be kept for out1 and out2 when vm 36 v. note 3: the absolute maximum output current rating of 4.0 a must be kept for out1 and out2 when vm > 36 v. note 4: ic only operating ranges characteristics symbol rating unit supply voltage vm opr 10 to 45 v osc frequency f osc up to 500 khz vref pin input voltage vref opr 0 to 3.6 v pwm frequency f pwm up to 100 khz output current i o (ave.) up to 1.5 (note 5) (given as a guide) a note 5: ta = 25 c, the TB6569FG is mounted on the pcb (70 70 1.6 (mm), double-sided, cu thickness: 50 m, cu dimension: 67%). * : the average output current shall be increased or decreas ed depending on usage conditions such as ambient temperature and ic mounting method). use the average output current so that the junction temperature of 150c (t j ) and the absolute maximum output current rating of 4.5 a or 4.0 a are not exceeded.
TB6569FG 2009-08-21 5 electrical characteristics (unless otherwise specified, ta = 25c, vm = 24 v) characteristics symbol test condition min typ. max unit i cc1 stop mode ? 3 8 i cc2 cw/ccw mode ? 3 8 power supply voltage i cc3 short brake mode ? 3 8 ma v inh 2 ? 5.5 input voltage v inl 0 ? 0.8 hysteresis voltage v in (hys) ? 0.4 ? v i inh v in = 5 v ? 50 75 control circuit in1 pin, in2 pin, pwm pin input current i inl v in = 0 v ? ? 5 a vref pin input current i invref ?3 ? 3 a constant-current control amplifier offset v offset rsgnd = vref ? 1 ? mv pwm frequency f pwm duty: 50 % ? 100 ? khz pwm minimum pulse width f pwm (tw) (given as a guide only) 1 ? ? s output on resistance r on (u + l) i o = 3 a ? 0.55 0.9 i l (u) vm = 50 v, v out = 0 v ?2 ? ? output leakage current i l (l) vm = v out = 50 v ? ? 2 a v f (u) i o = 3 a ? 1.3 1.7 out1 pin, out2 pin diode forward voltage v f (l) i o = ?3 a ? 1.3 1.7 v output fall time voltage v al (lo) i alert = 1 ma ? ? 0.4 v alert pin output leakage current i al (le) v alert = 5.5 v ? ? 2 a osc charge/discharge current i osc 0.3 0.5 0.7 ma thermal performance characteristics p d ? ta ambient temperature ta (c) power dissipation p d (w) (1) (2) 0 0 25 50 75 100 125 150 0.5 1.0 1.5 (1) on the pcb (60 30 1.6 (mm), cu: more than 50%: r th (j-a) = 89.3c /w, pd = 1.4 w when ta = 25c (2) ic only: r th (j-a) = 140c/w, p d = 0.89 w when ta = 25c. thermal resistance thermal resistance ( rth ) ? pulse width ( t ) input width ic only on the pcb (60 30 1.6 (mm), cu: more than 50%) input pulse
TB6569FG 2009-08-21 6 i/o equivalent circuits the equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. pin no. i/o signal i/o internal circuit in1 (3) in2 (5) digital input l: 0.8 v (max) h: 2 v (min) pwm (15) digital input l: 0.8 v (max) h: 2 v (min) vref (16) analog input input range: 0 v to 3.6 v alert (1) open-drain output an externally attached pull-up resistor enalbes the high output. h (high-impedance): abnormal operation (when the uvlo, tsd, vsd and/or isd is activated) l: normal operation osc (2) the pin connects a capacitor for controlling the oscillation frequency used in the pwm constant-current control. the oscillation frequency of the oscillator is approximated by the following formula: fosc = 0.42/(cosc [f] ? 10 3 ) = [hz] (typ.) visd (13) the pin connects a resistor controlling overcurrent detection threshold. pwm 100 k (typ.) in1 (in2) 10 k (typ.) 100 k (typ.) vref rsgnd alert osc visd
TB6569FG 2009-08-21 7 pin no. i/o signal i/o internal circuit tisd (14) the pin connects a resistor controlling overcurrent detection time. out1 (7) out2 (10) rsgnd (8) the rsgnd pin must be connected to a resistor for detection when it is used in the pwm constant-current control; it must be earthed to the ground, otherwise. utmost care must be taken for designing the pin-arrangement pattern because a large current flows through these pins. functional description the equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. timing charts may be simplified for explanatory purposes. 1. input/output functions input output in1 in2 pwm out1 out2 mode h l l h h l l l short brake h l h cw/ccw l h l l l short brake h h l ccw/cw h l l l l short brake h l l l off (hi-z) stop (a release of tsd and/or isd) 2. protective operation alert output (alert) the alert pin behaves as an open-drain output and provides a high-impedance state on output being pulled up by a resistor externally wired. the output is low when the TB6569FG performs a normal operation (in which state the operational mode is selectable through the in1 pin and in2 pin among cw, ccw, short brake and stop modes.). in any other cases (in which state the thermal shutdown circuit (tsd), overcurrent shutdown circuit (isd), overvoltage shutdown circuit (vsd) an d/or undervoltage lockout (uvlo) is activated), the output is high. driving both the in1 pin and in2 pin low allows a release of the shutdown operations; the TB6569FG resumes the normal operations. tisd out1 (out2) vm rsgnd 0.4 v (typ.)
TB6569FG 2009-08-21 8 3. undervoltage lockout circuit (uvlo) the TB6569FG incorporates an undervoltage lockout circuit. when the supply voltage drops under 8 v (typ.), all the outputs are turned off (hi-z). the uvlo circuit has a hysteresis of 0.7 v (typ.); the TB6569FG resumes the normal operation at 8.7 v (typ.). 4. overvoltage shutdown circuit (vsd) the TB6569FG incorporates an overvoltage shutdown circuit. if the supply voltage exceeds 53 v (typ.), all the outputs are turned off (hi-z). the vsd circuit has a hysteresis of 3 v (typ.); the TB6569FG resumes the normal operation at 50 v (typ.). note: the vsd circuit is activated if the absolute maximu m voltage rating is violated. note that the circuit is provided as an auxiliary only and does not necessarily provide the ic with a perfect protection from any kind of damages. 53 v (typ.) vm voltage vsd internal signal h l 50 v (typ.) vsd operation vsd operation alert output h l out1, out2 h l normal operation off (hi-z) normal operation 8.7 v (typ.) vm voltage uvlo internal signal h l 8.0 v (typ.) uvlo operation alert output h l out1, out2 h l normal operation off (hi-z) uvlo operation normal operation
TB6569FG 2009-08-21 9 5. thermal shutdown circuit (tsd) the TB6569FG incorporates a thermal shutdown circuit. if the junction temperature (t j ) exceeds 170 c (typ.), all the outputs are turned off (hi-z). driving both the in1 pin and in2 pin low allows a release of the shutdown operation; the TB6569FG resumes the normal operation. tsd = 170c (typ.) note: the tsd circuit is activated if the absolute maximum junction temperature rating (t j ) of 150c is violated. note that the circuit is provided as an auxiliary only and does not necessarily provide the ic with a perfect protection from any kind of damages. 170c (typ.) chip temperature j unction temperature (t j ) internal tsd signal h l tsd operation tsd operation alert output h l in1, in2 h l out1, out2 h l more than 1 s (typ.) normal operation off (hi-z) normal operation
TB6569FG 2009-08-21 10 6. overcurrent shutdown circuit (isd) the TB6569FG incorporates overcurrent shutdown (isd) circuits monitoring the current that flows through each of all the four output power transistors. the detection time threshold is programmable throug h the visd pin with a pull-up resistor. if the overcurrent flowing through any one of the isd circuit flows beyond the detected time threshold, all the outputs are turned off (hi-z). the detection time threshold is controllable thro ugh the external resistor of the tisd pin. driving both the in1 pin and in2 pin low allows a release of the shutdown operations; the TB6569FG resumes the normal operation. ? detection current threshold of the exte rnal resistor, r1, of the visd pin 10 k : 6.3 a (typ.) 20 k : 4.2a (typ.) 30 k : 3.1 a (typ.) ? detection time threshold of the external resistor, r2, of the tisd pin 10 k : 1.6 s (typ.) 20 k : 2.8 s (typ.) 100 k : 12.4 s (typ.) note: the isd circuit is activated if the absolute maximu m current rating is violated. note that the circuit is provided as an auxiliary only and does not necessari ly provide the ic with a perfect protection from damages due to overcurrent caused by powe r fault, ground fault, load-short and the like. internal isd signal h l alert output h l in1, in2 h l out1, out2 isd operation predefined visd value 0 t: predefined tisd value output current more than 1 s (typ.) normal operation off (hi-z) normal operation r2 visd pin tisd pin r1 ic
TB6569FG 2009-08-21 11 7. direct pwm control the motor rotation speed is controllable by the pwm input sent through the pwm pin. it is also possible to control the motor rotation sp eed by sending in the pwm signal through not the pwm pin but the in1 and in2 pins. when the motor drive is controlled by the pwm input, the TB6569FG repeats operating in normal operation mode and short brake mode alternately. for preventing the shoot-t hrough current in the output circuit caused by the upper and lower power transistors being turned on simultaneously, the dead time is internally generated at the time the upper and lower power transistors swit ches between on and off. this eliminates the need of inserting off time externally; thus the pwm control with synchronous rectification is enabled. note that inserting off time externally is not requ ired on operation mode changes between cw and ccw, and cw (ccw) and short brake, again, because of the dead time generated internally. pwm on t5 vm m gnd out1 vm m gnd pwm off t3 out1 vm m gnd pwm on t1 out1 vm m gnd pwm on off t2 = 200 ns (typ.) out1 vm m gnd pwm off on t4 = 500 ns (typ.) out1 rsgnd vm output voltage waveform (out1) t1 t2 t3 t5 t4
TB6569FG 2009-08-21 12 8. output circuit the switching characteristics of the output transist ors of the out1 and out2 pins are as shown below: characteristic value unit t plh 650 (typ.) t phl 450 (typ.) t r 90 (typ.) t f 130 (typ.) ns output voltage (out1, out2) 90% 10% 50% t plh t r 50% t phl 90% 10% t f pwm input (in1, in2)
TB6569FG 2009-08-21 13 9. pwm constant-current control the TB6569FG uses a peak current detection technique to keep the output current constant by applying constant voltage through the vref pin. when running in discharge mode, the TB6569FG powers the motor to operate in short brake mode. (1) pwm constant-current control programming the peak current upon the constant -current operation is determined by applying voltage on the vref pin. the peak current value is calculated by the following equation: i o = vref/r 1/10 [a] the pwm current-constant frequency is also progra mmable by using the capaci tor of the osc pin. the oscillation frequency is approximated by using the following equation: fosc = 0.42/(cosc [f] 10 3 ) = [hz] (typ.) for preventing the overvoltage on connecting a detection resistor, the rsgnd pin is driven high (the outputs are turned off (hi-z)) when the applied voltag e is over 0.4 v (typ.). the subsequent control of the rsgnd is the same as the isd circuit. the alert pin is also driven high. however, when the in1 and in2 pins are pulled low, the alert pin is pulled low and the TB6569FG resumes the normal operation. it is recommended to use a detection resistor of over 0.1 for the rsgnd pin. (2) constant-current chopping the TB6569FG enters discharge mode when v rsgnd reaches the predetermined voltage (vref/10). after a lapse of four internal clocks generated by the osc signal, the TB6569FG shifts to charge mode. vm m i o out1 1/10 r vref i o out2 rsgnd control circuit 0.4 v (typ.) isd a nalog input voltage osc osc control circuit control circuit v rsgnd vref/10 coil current vref/10 internal clk osc charge gnd discharge coil current discharge v rsgnd
TB6569FG 2009-08-21 14 (3) operation on change of predetermined current value (when in discharge mode) the TB6569FG enters discharge mode as v rsgnd reaches the predetermined voltage (vref/10) and then transits to charge mode after four internal clocks. however, if v rsgnd > vref/10 at the time, the TB6569FG goes back to discharge mode. if v rsgnd > vref/10 after another four internal clocks, then the TB6569FG enters charge mode and stays until v rsgnd reaches vref/10. (4) operation on change of predetermined current value (when in charge mode) even though vref reaches the pr edetermined current value, disc harge mode continues for four internal clocks after that. and then charge mode is entered. due to the peak current detection technique, th e average current value of the constant-current operation shall be smaller than th e predetermined value. because this depends on characteristics of used motor coils, precise identifica tion of the used motor coils must be performed when determining the current value. when both the pwm constant-current control and the direct pwm control (applying the pwm input on the pwm pin, or on the in1 and in2 pins), short brake mode is pr eferentially selected. v rsgnd discharge internal clk osc discharge charge gnd coil current vref/10 vref/10 discharge internal clk osc charge gnd discharge charge coil current 2.4 s (typ.)
TB6569FG 2009-08-21 15 package dimensions weight: 0.5 g (typ.)
TB6569FG 2009-08-21 16 notes on contents 1. block diagrams some of the functional blocks, circ uits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. equivalent circuits the equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. timing charts timing charts may be simplified for explanatory purposes. 4. application circuits the application circuits shown in this document ar e provided for reference purposes only. thorough evaluation is required, especially at the mass production design stage. toshiba does not grant any license to any industrial property rights by prov iding these examples of application circuits. 5. test circuits components in the test circuits are used only to obtain and confirm the devi ce characteristics. these components and circuits are not guaranteed to prev ent malfunction or failure from occurring in the application equipment. ic usage considerations notes on handling of ics (1) the absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. do not exceed any of these ratings. exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. (2) use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or ic failure. the ic will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large cu rrent to continuously flow and the breakdown can lead smoke or ignition. to minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. (3) if your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current re sulting from the inrush current at power on or the negative current result ing from the back electromotive force at power off. ic breakdown may cause injury, smoke or ignition. use a stable power supply with ics with built-in protec tion functions. if the power supply is unstable, the protection function may not operate, causing ic breakdown. ic breakdown may cause injury, smoke or ignition. (4) do not insert devices in the wrong orientation or incorrectly. make sure that the positive and negative terminals of power supplies are connected properly. otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. in addition, do not use any device that is applied th e current with inserting in the wrong orientation or incorrectly even just one time.
TB6569FG 2009-08-21 17 points to remember on handling of ics (1) over current protection circuit over current protection circuits (referred to as current limiter circuits) do not necessarily protect ics under all circumstances. if the ov er current protection circuits oper ate against the over current, clear the over current stat us immediately. depending on the method of use and usage condit ions, such as exceeding absolute maximum ratings can cause the over current protection circuit to not operate properly or ic breakdown before operation. in addition, depending on the method of use and usage conditions, if ov er current continues to flow for a long time after operation, the ic may generate heat resulting in breakdown. (2) thermal shutdown circuit thermal shutdown circuits do not necessarily prot ect ics under all circumst ances. if the thermal shutdown circuits operate against th e over temperature, clear the heat generation status immediately. depending on the method of use and usage condit ions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not oper ate properly or ic breakdown before operation. (3) heat radiation design in using an ic with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (t j ) at any time and condition. these ics generate heat even during normal use. an inadequate ic heat radiation design can lead to decrease in ic life, deterioration of ic characteristics or ic breakdown. in addition, please design the device taking into considerate the effect of ic heat radiation with peripheral components. (4) back-emf when a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor?s power supply due to the effect of back-emf. if the current sink capability of the power supply is small, the device?s mo tor power supply and output pins might be exposed to conditions beyond ma ximum ratings. to avoid this problem, take the effect of back-emf into consideration in system design.
TB6569FG 2009-08-21 18 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively ?toshiba?), reserve the right to make changes to the in formation in this document, and related hardware, software a nd systems (collectively ?product?) without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba?s written permission, reproduction is permissible only if reproduction is without alteration/omission. ? though toshiba works continually to improve product?s quality a nd reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid sit uations in which a malfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before creating and producing des igns and using, customers mus t also refer to and comply with (a) the latest versions of all relev ant toshiba information, including without limitation, this docume nt, the specifications, the data sheets and applicat ion notes for product and the precautions and conditions set forth in the ?toshiba semiconductor reliability handbook? and (b) the instructions for the application that product will be used with or for. custome rs are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining th e appropriateness of the use of this product in such design or applications; (b) evaluating and det ermining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operati ng parameters for such designs and applications. toshiba assumes no liability for customers? product design or applications. ? product is intended for use in general el ectronics applications (e.g., computers, personal equipment, office equipment, measur ing equipment, industrial robots and home electroni cs appliances) or for specif ic applications as expre ssly stated in this document . product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality a nd/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or se rious public impact (?unintended use?). unintended use includes, without limit ation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equi pment used for automobiles, trains, ships and other transportation, traffic signalin g equipment, equipment used to control combustions or explosions, safety dev ices, elevators and escalato rs, devices related to el ectric power, and equipment used in finance-related fi elds. do not use product for unintended us e unless specifically permitted in thi s document. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is pres ented only as guidance for product use. no re sponsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? absent a written signed agreement, except as provid ed in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability wh atsoever, including without limitation, indirect, co nsequential, special, or incidental damages or loss, including without limitation, loss of profit s, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? do not use or otherwise make available product or related so ftware or technology for any m ilitary purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technolog y products (mass destruction weapons). product and related softwa re and technology may be controlled under the japanese foreign exchange and foreign trade law and the u.s. export administration regulations. export and re-export of product or related softw are or technology are strictly prohibited except in comp liance with all applicable export laws and regulations. ? please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of pro duct. please use product in compliance with all applicable laws and regula tions that regulate the inclusion or use of controlled subs tances, including without limitation, the eu rohs directive. toshiba assumes no liability for damages or losses occurring as a result o f noncompliance with applicable laws and regulations.


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